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Thermal: update documentation for thermal_zone_device_register
Update kernel Documentation for thermal_zone_device_register. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Showing 1 changed file with 11 additions and 3 deletions Inline Diff
Documentation/thermal/sysfs-api.txt
1 | Generic Thermal Sysfs driver How To | 1 | Generic Thermal Sysfs driver How To |
2 | =================================== | 2 | =================================== |
3 | 3 | ||
4 | Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> | 4 | Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> |
5 | 5 | ||
6 | Updated: 2 January 2008 | 6 | Updated: 2 January 2008 |
7 | 7 | ||
8 | Copyright (c) 2008 Intel Corporation | 8 | Copyright (c) 2008 Intel Corporation |
9 | 9 | ||
10 | 10 | ||
11 | 0. Introduction | 11 | 0. Introduction |
12 | 12 | ||
13 | The generic thermal sysfs provides a set of interfaces for thermal zone | 13 | The generic thermal sysfs provides a set of interfaces for thermal zone |
14 | devices (sensors) and thermal cooling devices (fan, processor...) to register | 14 | devices (sensors) and thermal cooling devices (fan, processor...) to register |
15 | with the thermal management solution and to be a part of it. | 15 | with the thermal management solution and to be a part of it. |
16 | 16 | ||
17 | This how-to focuses on enabling new thermal zone and cooling devices to | 17 | This how-to focuses on enabling new thermal zone and cooling devices to |
18 | participate in thermal management. | 18 | participate in thermal management. |
19 | This solution is platform independent and any type of thermal zone devices | 19 | This solution is platform independent and any type of thermal zone devices |
20 | and cooling devices should be able to make use of the infrastructure. | 20 | and cooling devices should be able to make use of the infrastructure. |
21 | 21 | ||
22 | The main task of the thermal sysfs driver is to expose thermal zone attributes | 22 | The main task of the thermal sysfs driver is to expose thermal zone attributes |
23 | as well as cooling device attributes to the user space. | 23 | as well as cooling device attributes to the user space. |
24 | An intelligent thermal management application can make decisions based on | 24 | An intelligent thermal management application can make decisions based on |
25 | inputs from thermal zone attributes (the current temperature and trip point | 25 | inputs from thermal zone attributes (the current temperature and trip point |
26 | temperature) and throttle appropriate devices. | 26 | temperature) and throttle appropriate devices. |
27 | 27 | ||
28 | [0-*] denotes any positive number starting from 0 | 28 | [0-*] denotes any positive number starting from 0 |
29 | [1-*] denotes any positive number starting from 1 | 29 | [1-*] denotes any positive number starting from 1 |
30 | 30 | ||
31 | 1. thermal sysfs driver interface functions | 31 | 1. thermal sysfs driver interface functions |
32 | 32 | ||
33 | 1.1 thermal zone device interface | 33 | 1.1 thermal zone device interface |
34 | 1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, | 34 | 1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *type, |
35 | int trips, int mask, void *devdata, | 35 | int trips, int mask, void *devdata, |
36 | struct thermal_zone_device_ops *ops) | 36 | struct thermal_zone_device_ops *ops, |
37 | const struct thermal_zone_params *tzp, | ||
38 | int passive_delay, int polling_delay)) | ||
37 | 39 | ||
38 | This interface function adds a new thermal zone device (sensor) to | 40 | This interface function adds a new thermal zone device (sensor) to |
39 | /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the | 41 | /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the |
40 | thermal cooling devices registered at the same time. | 42 | thermal cooling devices registered at the same time. |
41 | 43 | ||
42 | name: the thermal zone name. | 44 | type: the thermal zone type. |
43 | trips: the total number of trip points this thermal zone supports. | 45 | trips: the total number of trip points this thermal zone supports. |
44 | mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. | 46 | mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. |
45 | devdata: device private data | 47 | devdata: device private data |
46 | ops: thermal zone device call-backs. | 48 | ops: thermal zone device call-backs. |
47 | .bind: bind the thermal zone device with a thermal cooling device. | 49 | .bind: bind the thermal zone device with a thermal cooling device. |
48 | .unbind: unbind the thermal zone device with a thermal cooling device. | 50 | .unbind: unbind the thermal zone device with a thermal cooling device. |
49 | .get_temp: get the current temperature of the thermal zone. | 51 | .get_temp: get the current temperature of the thermal zone. |
50 | .get_mode: get the current mode (enabled/disabled) of the thermal zone. | 52 | .get_mode: get the current mode (enabled/disabled) of the thermal zone. |
51 | - "enabled" means the kernel thermal management is enabled. | 53 | - "enabled" means the kernel thermal management is enabled. |
52 | - "disabled" will prevent kernel thermal driver action upon trip points | 54 | - "disabled" will prevent kernel thermal driver action upon trip points |
53 | so that user applications can take charge of thermal management. | 55 | so that user applications can take charge of thermal management. |
54 | .set_mode: set the mode (enabled/disabled) of the thermal zone. | 56 | .set_mode: set the mode (enabled/disabled) of the thermal zone. |
55 | .get_trip_type: get the type of certain trip point. | 57 | .get_trip_type: get the type of certain trip point. |
56 | .get_trip_temp: get the temperature above which the certain trip point | 58 | .get_trip_temp: get the temperature above which the certain trip point |
57 | will be fired. | 59 | will be fired. |
58 | .set_emul_temp: set the emulation temperature which helps in debugging | 60 | .set_emul_temp: set the emulation temperature which helps in debugging |
59 | different threshold temperature points. | 61 | different threshold temperature points. |
62 | tzp: thermal zone platform parameters. | ||
63 | passive_delay: number of milliseconds to wait between polls when | ||
64 | performing passive cooling. | ||
65 | polling_delay: number of milliseconds to wait between polls when checking | ||
66 | whether trip points have been crossed (0 for interrupt driven systems). | ||
67 | |||
60 | 68 | ||
61 | 1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) | 69 | 1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) |
62 | 70 | ||
63 | This interface function removes the thermal zone device. | 71 | This interface function removes the thermal zone device. |
64 | It deletes the corresponding entry form /sys/class/thermal folder and | 72 | It deletes the corresponding entry form /sys/class/thermal folder and |
65 | unbind all the thermal cooling devices it uses. | 73 | unbind all the thermal cooling devices it uses. |
66 | 74 | ||
67 | 1.2 thermal cooling device interface | 75 | 1.2 thermal cooling device interface |
68 | 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, | 76 | 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, |
69 | void *devdata, struct thermal_cooling_device_ops *) | 77 | void *devdata, struct thermal_cooling_device_ops *) |
70 | 78 | ||
71 | This interface function adds a new thermal cooling device (fan/processor/...) | 79 | This interface function adds a new thermal cooling device (fan/processor/...) |
72 | to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself | 80 | to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself |
73 | to all the thermal zone devices register at the same time. | 81 | to all the thermal zone devices register at the same time. |
74 | name: the cooling device name. | 82 | name: the cooling device name. |
75 | devdata: device private data. | 83 | devdata: device private data. |
76 | ops: thermal cooling devices call-backs. | 84 | ops: thermal cooling devices call-backs. |
77 | .get_max_state: get the Maximum throttle state of the cooling device. | 85 | .get_max_state: get the Maximum throttle state of the cooling device. |
78 | .get_cur_state: get the Current throttle state of the cooling device. | 86 | .get_cur_state: get the Current throttle state of the cooling device. |
79 | .set_cur_state: set the Current throttle state of the cooling device. | 87 | .set_cur_state: set the Current throttle state of the cooling device. |
80 | 88 | ||
81 | 1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) | 89 | 1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) |
82 | 90 | ||
83 | This interface function remove the thermal cooling device. | 91 | This interface function remove the thermal cooling device. |
84 | It deletes the corresponding entry form /sys/class/thermal folder and | 92 | It deletes the corresponding entry form /sys/class/thermal folder and |
85 | unbind itself from all the thermal zone devices using it. | 93 | unbind itself from all the thermal zone devices using it. |
86 | 94 | ||
87 | 1.3 interface for binding a thermal zone device with a thermal cooling device | 95 | 1.3 interface for binding a thermal zone device with a thermal cooling device |
88 | 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, | 96 | 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, |
89 | int trip, struct thermal_cooling_device *cdev, | 97 | int trip, struct thermal_cooling_device *cdev, |
90 | unsigned long upper, unsigned long lower); | 98 | unsigned long upper, unsigned long lower); |
91 | 99 | ||
92 | This interface function bind a thermal cooling device to the certain trip | 100 | This interface function bind a thermal cooling device to the certain trip |
93 | point of a thermal zone device. | 101 | point of a thermal zone device. |
94 | This function is usually called in the thermal zone device .bind callback. | 102 | This function is usually called in the thermal zone device .bind callback. |
95 | tz: the thermal zone device | 103 | tz: the thermal zone device |
96 | cdev: thermal cooling device | 104 | cdev: thermal cooling device |
97 | trip: indicates which trip point the cooling devices is associated with | 105 | trip: indicates which trip point the cooling devices is associated with |
98 | in this thermal zone. | 106 | in this thermal zone. |
99 | upper:the Maximum cooling state for this trip point. | 107 | upper:the Maximum cooling state for this trip point. |
100 | THERMAL_NO_LIMIT means no upper limit, | 108 | THERMAL_NO_LIMIT means no upper limit, |
101 | and the cooling device can be in max_state. | 109 | and the cooling device can be in max_state. |
102 | lower:the Minimum cooling state can be used for this trip point. | 110 | lower:the Minimum cooling state can be used for this trip point. |
103 | THERMAL_NO_LIMIT means no lower limit, | 111 | THERMAL_NO_LIMIT means no lower limit, |
104 | and the cooling device can be in cooling state 0. | 112 | and the cooling device can be in cooling state 0. |
105 | 113 | ||
106 | 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, | 114 | 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, |
107 | int trip, struct thermal_cooling_device *cdev); | 115 | int trip, struct thermal_cooling_device *cdev); |
108 | 116 | ||
109 | This interface function unbind a thermal cooling device from the certain | 117 | This interface function unbind a thermal cooling device from the certain |
110 | trip point of a thermal zone device. This function is usually called in | 118 | trip point of a thermal zone device. This function is usually called in |
111 | the thermal zone device .unbind callback. | 119 | the thermal zone device .unbind callback. |
112 | tz: the thermal zone device | 120 | tz: the thermal zone device |
113 | cdev: thermal cooling device | 121 | cdev: thermal cooling device |
114 | trip: indicates which trip point the cooling devices is associated with | 122 | trip: indicates which trip point the cooling devices is associated with |
115 | in this thermal zone. | 123 | in this thermal zone. |
116 | 124 | ||
117 | 1.4 Thermal Zone Parameters | 125 | 1.4 Thermal Zone Parameters |
118 | 1.4.1 struct thermal_bind_params | 126 | 1.4.1 struct thermal_bind_params |
119 | This structure defines the following parameters that are used to bind | 127 | This structure defines the following parameters that are used to bind |
120 | a zone with a cooling device for a particular trip point. | 128 | a zone with a cooling device for a particular trip point. |
121 | .cdev: The cooling device pointer | 129 | .cdev: The cooling device pointer |
122 | .weight: The 'influence' of a particular cooling device on this zone. | 130 | .weight: The 'influence' of a particular cooling device on this zone. |
123 | This is on a percentage scale. The sum of all these weights | 131 | This is on a percentage scale. The sum of all these weights |
124 | (for a particular zone) cannot exceed 100. | 132 | (for a particular zone) cannot exceed 100. |
125 | .trip_mask:This is a bit mask that gives the binding relation between | 133 | .trip_mask:This is a bit mask that gives the binding relation between |
126 | this thermal zone and cdev, for a particular trip point. | 134 | this thermal zone and cdev, for a particular trip point. |
127 | If nth bit is set, then the cdev and thermal zone are bound | 135 | If nth bit is set, then the cdev and thermal zone are bound |
128 | for trip point n. | 136 | for trip point n. |
129 | .match: This call back returns success(0) if the 'tz and cdev' need to | 137 | .match: This call back returns success(0) if the 'tz and cdev' need to |
130 | be bound, as per platform data. | 138 | be bound, as per platform data. |
131 | 1.4.2 struct thermal_zone_params | 139 | 1.4.2 struct thermal_zone_params |
132 | This structure defines the platform level parameters for a thermal zone. | 140 | This structure defines the platform level parameters for a thermal zone. |
133 | This data, for each thermal zone should come from the platform layer. | 141 | This data, for each thermal zone should come from the platform layer. |
134 | This is an optional feature where some platforms can choose not to | 142 | This is an optional feature where some platforms can choose not to |
135 | provide this data. | 143 | provide this data. |
136 | .governor_name: Name of the thermal governor used for this zone | 144 | .governor_name: Name of the thermal governor used for this zone |
137 | .num_tbps: Number of thermal_bind_params entries for this zone | 145 | .num_tbps: Number of thermal_bind_params entries for this zone |
138 | .tbp: thermal_bind_params entries | 146 | .tbp: thermal_bind_params entries |
139 | 147 | ||
140 | 2. sysfs attributes structure | 148 | 2. sysfs attributes structure |
141 | 149 | ||
142 | RO read only value | 150 | RO read only value |
143 | RW read/write value | 151 | RW read/write value |
144 | 152 | ||
145 | Thermal sysfs attributes will be represented under /sys/class/thermal. | 153 | Thermal sysfs attributes will be represented under /sys/class/thermal. |
146 | Hwmon sysfs I/F extension is also available under /sys/class/hwmon | 154 | Hwmon sysfs I/F extension is also available under /sys/class/hwmon |
147 | if hwmon is compiled in or built as a module. | 155 | if hwmon is compiled in or built as a module. |
148 | 156 | ||
149 | Thermal zone device sys I/F, created once it's registered: | 157 | Thermal zone device sys I/F, created once it's registered: |
150 | /sys/class/thermal/thermal_zone[0-*]: | 158 | /sys/class/thermal/thermal_zone[0-*]: |
151 | |---type: Type of the thermal zone | 159 | |---type: Type of the thermal zone |
152 | |---temp: Current temperature | 160 | |---temp: Current temperature |
153 | |---mode: Working mode of the thermal zone | 161 | |---mode: Working mode of the thermal zone |
154 | |---policy: Thermal governor used for this zone | 162 | |---policy: Thermal governor used for this zone |
155 | |---trip_point_[0-*]_temp: Trip point temperature | 163 | |---trip_point_[0-*]_temp: Trip point temperature |
156 | |---trip_point_[0-*]_type: Trip point type | 164 | |---trip_point_[0-*]_type: Trip point type |
157 | |---trip_point_[0-*]_hyst: Hysteresis value for this trip point | 165 | |---trip_point_[0-*]_hyst: Hysteresis value for this trip point |
158 | |---emul_temp: Emulated temperature set node | 166 | |---emul_temp: Emulated temperature set node |
159 | 167 | ||
160 | Thermal cooling device sys I/F, created once it's registered: | 168 | Thermal cooling device sys I/F, created once it's registered: |
161 | /sys/class/thermal/cooling_device[0-*]: | 169 | /sys/class/thermal/cooling_device[0-*]: |
162 | |---type: Type of the cooling device(processor/fan/...) | 170 | |---type: Type of the cooling device(processor/fan/...) |
163 | |---max_state: Maximum cooling state of the cooling device | 171 | |---max_state: Maximum cooling state of the cooling device |
164 | |---cur_state: Current cooling state of the cooling device | 172 | |---cur_state: Current cooling state of the cooling device |
165 | 173 | ||
166 | 174 | ||
167 | Then next two dynamic attributes are created/removed in pairs. They represent | 175 | Then next two dynamic attributes are created/removed in pairs. They represent |
168 | the relationship between a thermal zone and its associated cooling device. | 176 | the relationship between a thermal zone and its associated cooling device. |
169 | They are created/removed for each successful execution of | 177 | They are created/removed for each successful execution of |
170 | thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. | 178 | thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. |
171 | 179 | ||
172 | /sys/class/thermal/thermal_zone[0-*]: | 180 | /sys/class/thermal/thermal_zone[0-*]: |
173 | |---cdev[0-*]: [0-*]th cooling device in current thermal zone | 181 | |---cdev[0-*]: [0-*]th cooling device in current thermal zone |
174 | |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with | 182 | |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with |
175 | 183 | ||
176 | Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, | 184 | Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, |
177 | the generic thermal driver also creates a hwmon sysfs I/F for each _type_ | 185 | the generic thermal driver also creates a hwmon sysfs I/F for each _type_ |
178 | of thermal zone device. E.g. the generic thermal driver registers one hwmon | 186 | of thermal zone device. E.g. the generic thermal driver registers one hwmon |
179 | class device and build the associated hwmon sysfs I/F for all the registered | 187 | class device and build the associated hwmon sysfs I/F for all the registered |
180 | ACPI thermal zones. | 188 | ACPI thermal zones. |
181 | 189 | ||
182 | /sys/class/hwmon/hwmon[0-*]: | 190 | /sys/class/hwmon/hwmon[0-*]: |
183 | |---name: The type of the thermal zone devices | 191 | |---name: The type of the thermal zone devices |
184 | |---temp[1-*]_input: The current temperature of thermal zone [1-*] | 192 | |---temp[1-*]_input: The current temperature of thermal zone [1-*] |
185 | |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] | 193 | |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] |
186 | 194 | ||
187 | Please read Documentation/hwmon/sysfs-interface for additional information. | 195 | Please read Documentation/hwmon/sysfs-interface for additional information. |
188 | 196 | ||
189 | *************************** | 197 | *************************** |
190 | * Thermal zone attributes * | 198 | * Thermal zone attributes * |
191 | *************************** | 199 | *************************** |
192 | 200 | ||
193 | type | 201 | type |
194 | Strings which represent the thermal zone type. | 202 | Strings which represent the thermal zone type. |
195 | This is given by thermal zone driver as part of registration. | 203 | This is given by thermal zone driver as part of registration. |
196 | E.g: "acpitz" indicates it's an ACPI thermal device. | 204 | E.g: "acpitz" indicates it's an ACPI thermal device. |
197 | In order to keep it consistent with hwmon sys attribute; this should | 205 | In order to keep it consistent with hwmon sys attribute; this should |
198 | be a short, lowercase string, not containing spaces nor dashes. | 206 | be a short, lowercase string, not containing spaces nor dashes. |
199 | RO, Required | 207 | RO, Required |
200 | 208 | ||
201 | temp | 209 | temp |
202 | Current temperature as reported by thermal zone (sensor). | 210 | Current temperature as reported by thermal zone (sensor). |
203 | Unit: millidegree Celsius | 211 | Unit: millidegree Celsius |
204 | RO, Required | 212 | RO, Required |
205 | 213 | ||
206 | mode | 214 | mode |
207 | One of the predefined values in [enabled, disabled]. | 215 | One of the predefined values in [enabled, disabled]. |
208 | This file gives information about the algorithm that is currently | 216 | This file gives information about the algorithm that is currently |
209 | managing the thermal zone. It can be either default kernel based | 217 | managing the thermal zone. It can be either default kernel based |
210 | algorithm or user space application. | 218 | algorithm or user space application. |
211 | enabled = enable Kernel Thermal management. | 219 | enabled = enable Kernel Thermal management. |
212 | disabled = Preventing kernel thermal zone driver actions upon | 220 | disabled = Preventing kernel thermal zone driver actions upon |
213 | trip points so that user application can take full | 221 | trip points so that user application can take full |
214 | charge of the thermal management. | 222 | charge of the thermal management. |
215 | RW, Optional | 223 | RW, Optional |
216 | 224 | ||
217 | policy | 225 | policy |
218 | One of the various thermal governors used for a particular zone. | 226 | One of the various thermal governors used for a particular zone. |
219 | RW, Required | 227 | RW, Required |
220 | 228 | ||
221 | trip_point_[0-*]_temp | 229 | trip_point_[0-*]_temp |
222 | The temperature above which trip point will be fired. | 230 | The temperature above which trip point will be fired. |
223 | Unit: millidegree Celsius | 231 | Unit: millidegree Celsius |
224 | RO, Optional | 232 | RO, Optional |
225 | 233 | ||
226 | trip_point_[0-*]_type | 234 | trip_point_[0-*]_type |
227 | Strings which indicate the type of the trip point. | 235 | Strings which indicate the type of the trip point. |
228 | E.g. it can be one of critical, hot, passive, active[0-*] for ACPI | 236 | E.g. it can be one of critical, hot, passive, active[0-*] for ACPI |
229 | thermal zone. | 237 | thermal zone. |
230 | RO, Optional | 238 | RO, Optional |
231 | 239 | ||
232 | trip_point_[0-*]_hyst | 240 | trip_point_[0-*]_hyst |
233 | The hysteresis value for a trip point, represented as an integer | 241 | The hysteresis value for a trip point, represented as an integer |
234 | Unit: Celsius | 242 | Unit: Celsius |
235 | RW, Optional | 243 | RW, Optional |
236 | 244 | ||
237 | cdev[0-*] | 245 | cdev[0-*] |
238 | Sysfs link to the thermal cooling device node where the sys I/F | 246 | Sysfs link to the thermal cooling device node where the sys I/F |
239 | for cooling device throttling control represents. | 247 | for cooling device throttling control represents. |
240 | RO, Optional | 248 | RO, Optional |
241 | 249 | ||
242 | cdev[0-*]_trip_point | 250 | cdev[0-*]_trip_point |
243 | The trip point with which cdev[0-*] is associated in this thermal | 251 | The trip point with which cdev[0-*] is associated in this thermal |
244 | zone; -1 means the cooling device is not associated with any trip | 252 | zone; -1 means the cooling device is not associated with any trip |
245 | point. | 253 | point. |
246 | RO, Optional | 254 | RO, Optional |
247 | 255 | ||
248 | passive | 256 | passive |
249 | Attribute is only present for zones in which the passive cooling | 257 | Attribute is only present for zones in which the passive cooling |
250 | policy is not supported by native thermal driver. Default is zero | 258 | policy is not supported by native thermal driver. Default is zero |
251 | and can be set to a temperature (in millidegrees) to enable a | 259 | and can be set to a temperature (in millidegrees) to enable a |
252 | passive trip point for the zone. Activation is done by polling with | 260 | passive trip point for the zone. Activation is done by polling with |
253 | an interval of 1 second. | 261 | an interval of 1 second. |
254 | Unit: millidegrees Celsius | 262 | Unit: millidegrees Celsius |
255 | Valid values: 0 (disabled) or greater than 1000 | 263 | Valid values: 0 (disabled) or greater than 1000 |
256 | RW, Optional | 264 | RW, Optional |
257 | 265 | ||
258 | emul_temp | 266 | emul_temp |
259 | Interface to set the emulated temperature method in thermal zone | 267 | Interface to set the emulated temperature method in thermal zone |
260 | (sensor). After setting this temperature, the thermal zone may pass | 268 | (sensor). After setting this temperature, the thermal zone may pass |
261 | this temperature to platform emulation function if registered or | 269 | this temperature to platform emulation function if registered or |
262 | cache it locally. This is useful in debugging different temperature | 270 | cache it locally. This is useful in debugging different temperature |
263 | threshold and its associated cooling action. This is write only node | 271 | threshold and its associated cooling action. This is write only node |
264 | and writing 0 on this node should disable emulation. | 272 | and writing 0 on this node should disable emulation. |
265 | Unit: millidegree Celsius | 273 | Unit: millidegree Celsius |
266 | WO, Optional | 274 | WO, Optional |
267 | 275 | ||
268 | WARNING: Be careful while enabling this option on production systems, | 276 | WARNING: Be careful while enabling this option on production systems, |
269 | because userland can easily disable the thermal policy by simply | 277 | because userland can easily disable the thermal policy by simply |
270 | flooding this sysfs node with low temperature values. | 278 | flooding this sysfs node with low temperature values. |
271 | 279 | ||
272 | ***************************** | 280 | ***************************** |
273 | * Cooling device attributes * | 281 | * Cooling device attributes * |
274 | ***************************** | 282 | ***************************** |
275 | 283 | ||
276 | type | 284 | type |
277 | String which represents the type of device, e.g: | 285 | String which represents the type of device, e.g: |
278 | - for generic ACPI: should be "Fan", "Processor" or "LCD" | 286 | - for generic ACPI: should be "Fan", "Processor" or "LCD" |
279 | - for memory controller device on intel_menlow platform: | 287 | - for memory controller device on intel_menlow platform: |
280 | should be "Memory controller". | 288 | should be "Memory controller". |
281 | RO, Required | 289 | RO, Required |
282 | 290 | ||
283 | max_state | 291 | max_state |
284 | The maximum permissible cooling state of this cooling device. | 292 | The maximum permissible cooling state of this cooling device. |
285 | RO, Required | 293 | RO, Required |
286 | 294 | ||
287 | cur_state | 295 | cur_state |
288 | The current cooling state of this cooling device. | 296 | The current cooling state of this cooling device. |
289 | The value can any integer numbers between 0 and max_state: | 297 | The value can any integer numbers between 0 and max_state: |
290 | - cur_state == 0 means no cooling | 298 | - cur_state == 0 means no cooling |
291 | - cur_state == max_state means the maximum cooling. | 299 | - cur_state == max_state means the maximum cooling. |
292 | RW, Required | 300 | RW, Required |
293 | 301 | ||
294 | 3. A simple implementation | 302 | 3. A simple implementation |
295 | 303 | ||
296 | ACPI thermal zone may support multiple trip points like critical, hot, | 304 | ACPI thermal zone may support multiple trip points like critical, hot, |
297 | passive, active. If an ACPI thermal zone supports critical, passive, | 305 | passive, active. If an ACPI thermal zone supports critical, passive, |
298 | active[0] and active[1] at the same time, it may register itself as a | 306 | active[0] and active[1] at the same time, it may register itself as a |
299 | thermal_zone_device (thermal_zone1) with 4 trip points in all. | 307 | thermal_zone_device (thermal_zone1) with 4 trip points in all. |
300 | It has one processor and one fan, which are both registered as | 308 | It has one processor and one fan, which are both registered as |
301 | thermal_cooling_device. | 309 | thermal_cooling_device. |
302 | 310 | ||
303 | If the processor is listed in _PSL method, and the fan is listed in _AL0 | 311 | If the processor is listed in _PSL method, and the fan is listed in _AL0 |
304 | method, the sys I/F structure will be built like this: | 312 | method, the sys I/F structure will be built like this: |
305 | 313 | ||
306 | /sys/class/thermal: | 314 | /sys/class/thermal: |
307 | 315 | ||
308 | |thermal_zone1: | 316 | |thermal_zone1: |
309 | |---type: acpitz | 317 | |---type: acpitz |
310 | |---temp: 37000 | 318 | |---temp: 37000 |
311 | |---mode: enabled | 319 | |---mode: enabled |
312 | |---policy: step_wise | 320 | |---policy: step_wise |
313 | |---trip_point_0_temp: 100000 | 321 | |---trip_point_0_temp: 100000 |
314 | |---trip_point_0_type: critical | 322 | |---trip_point_0_type: critical |
315 | |---trip_point_1_temp: 80000 | 323 | |---trip_point_1_temp: 80000 |
316 | |---trip_point_1_type: passive | 324 | |---trip_point_1_type: passive |
317 | |---trip_point_2_temp: 70000 | 325 | |---trip_point_2_temp: 70000 |
318 | |---trip_point_2_type: active0 | 326 | |---trip_point_2_type: active0 |
319 | |---trip_point_3_temp: 60000 | 327 | |---trip_point_3_temp: 60000 |
320 | |---trip_point_3_type: active1 | 328 | |---trip_point_3_type: active1 |
321 | |---cdev0: --->/sys/class/thermal/cooling_device0 | 329 | |---cdev0: --->/sys/class/thermal/cooling_device0 |
322 | |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ | 330 | |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ |
323 | |---cdev1: --->/sys/class/thermal/cooling_device3 | 331 | |---cdev1: --->/sys/class/thermal/cooling_device3 |
324 | |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ | 332 | |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ |
325 | 333 | ||
326 | |cooling_device0: | 334 | |cooling_device0: |
327 | |---type: Processor | 335 | |---type: Processor |
328 | |---max_state: 8 | 336 | |---max_state: 8 |
329 | |---cur_state: 0 | 337 | |---cur_state: 0 |
330 | 338 | ||
331 | |cooling_device3: | 339 | |cooling_device3: |
332 | |---type: Fan | 340 | |---type: Fan |
333 | |---max_state: 2 | 341 | |---max_state: 2 |
334 | |---cur_state: 0 | 342 | |---cur_state: 0 |
335 | 343 | ||
336 | /sys/class/hwmon: | 344 | /sys/class/hwmon: |
337 | 345 | ||
338 | |hwmon0: | 346 | |hwmon0: |
339 | |---name: acpitz | 347 | |---name: acpitz |
340 | |---temp1_input: 37000 | 348 | |---temp1_input: 37000 |
341 | |---temp1_crit: 100000 | 349 | |---temp1_crit: 100000 |
342 | 350 | ||
343 | 4. Event Notification | 351 | 4. Event Notification |
344 | 352 | ||
345 | The framework includes a simple notification mechanism, in the form of a | 353 | The framework includes a simple notification mechanism, in the form of a |
346 | netlink event. Netlink socket initialization is done during the _init_ | 354 | netlink event. Netlink socket initialization is done during the _init_ |
347 | of the framework. Drivers which intend to use the notification mechanism | 355 | of the framework. Drivers which intend to use the notification mechanism |
348 | just need to call thermal_generate_netlink_event() with two arguments viz | 356 | just need to call thermal_generate_netlink_event() with two arguments viz |
349 | (originator, event). The originator is a pointer to struct thermal_zone_device | 357 | (originator, event). The originator is a pointer to struct thermal_zone_device |
350 | from where the event has been originated. An integer which represents the | 358 | from where the event has been originated. An integer which represents the |
351 | thermal zone device will be used in the message to identify the zone. The | 359 | thermal zone device will be used in the message to identify the zone. The |
352 | event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL, | 360 | event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL, |
353 | THERMAL_DEV_FAULT}. Notification can be sent when the current temperature | 361 | THERMAL_DEV_FAULT}. Notification can be sent when the current temperature |
354 | crosses any of the configured thresholds. | 362 | crosses any of the configured thresholds. |
355 | 363 | ||
356 | 5. Export Symbol APIs: | 364 | 5. Export Symbol APIs: |
357 | 365 | ||
358 | 5.1: get_tz_trend: | 366 | 5.1: get_tz_trend: |
359 | This function returns the trend of a thermal zone, i.e the rate of change | 367 | This function returns the trend of a thermal zone, i.e the rate of change |
360 | of temperature of the thermal zone. Ideally, the thermal sensor drivers | 368 | of temperature of the thermal zone. Ideally, the thermal sensor drivers |
361 | are supposed to implement the callback. If they don't, the thermal | 369 | are supposed to implement the callback. If they don't, the thermal |
362 | framework calculated the trend by comparing the previous and the current | 370 | framework calculated the trend by comparing the previous and the current |
363 | temperature values. | 371 | temperature values. |
364 | 372 | ||
365 | 5.2:get_thermal_instance: | 373 | 5.2:get_thermal_instance: |
366 | This function returns the thermal_instance corresponding to a given | 374 | This function returns the thermal_instance corresponding to a given |
367 | {thermal_zone, cooling_device, trip_point} combination. Returns NULL | 375 | {thermal_zone, cooling_device, trip_point} combination. Returns NULL |
368 | if such an instance does not exist. | 376 | if such an instance does not exist. |
369 | 377 | ||
370 | 5.3:thermal_notify_framework: | 378 | 5.3:thermal_notify_framework: |
371 | This function handles the trip events from sensor drivers. It starts | 379 | This function handles the trip events from sensor drivers. It starts |
372 | throttling the cooling devices according to the policy configured. | 380 | throttling the cooling devices according to the policy configured. |
373 | For CRITICAL and HOT trip points, this notifies the respective drivers, | 381 | For CRITICAL and HOT trip points, this notifies the respective drivers, |
374 | and does actual throttling for other trip points i.e ACTIVE and PASSIVE. | 382 | and does actual throttling for other trip points i.e ACTIVE and PASSIVE. |
375 | The throttling policy is based on the configured platform data; if no | 383 | The throttling policy is based on the configured platform data; if no |
376 | platform data is provided, this uses the step_wise throttling policy. | 384 | platform data is provided, this uses the step_wise throttling policy. |
377 | 385 | ||
378 | 5.4:thermal_cdev_update: | 386 | 5.4:thermal_cdev_update: |
379 | This function serves as an arbitrator to set the state of a cooling | 387 | This function serves as an arbitrator to set the state of a cooling |
380 | device. It sets the cooling device to the deepest cooling state if | 388 | device. It sets the cooling device to the deepest cooling state if |
381 | possible. | 389 | possible. |
382 | 390 |