05 May, 2015
1 commit
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Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Kapileshwar Singh
Signed-off-by: Punit Agrawal
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
17 Dec, 2014
1 commit
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The documentation of of_cpufreq_cooling_register() and
cpufreq_cooling_register() say that they return ERR_PTR() on error.
Accordingly, callers only check for IS_ERR(). Therefore, make them
return ERR_PTR(-ENOSYS) as is customary in the kernel when config
options are missing.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
04 Dec, 2013
1 commit
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This patch introduces an API to register cpufreq cooling device
based on device tree node.The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.Cc: Zhang Rui
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin
08 Jul, 2013
1 commit
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The function stub for cpufreq_cooling_get_level introduced
in 57df81069 "Thermal: exynos: fix cooling state translation"
is not syntactically correct C and needs to be fixed to avoid
this error:In file included from drivers/thermal/db8500_thermal.c:20:0:
include/linux/cpu_cooling.h: In function 'cpufreq_cooling_get_level':
include/linux/cpu_cooling.h:57:1:
error: parameter name omitted unsigned long cpufreq_cooling_get_level(unsigned int, unsigned int) ^
include/linux/cpu_cooling.h:57:1: error: parameter name omittedSigned-off-by: Arnd Bergmann
Acked-by: Eduardo Valentin
Cc: Zhang Rui
Cc: Amit Daniel kachhap
Cc: stable@vger.kernel.org
Signed-off-by: Eduardo Valentin
27 Apr, 2013
1 commit
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To improve code readiness, change the way the lines
are broken in this file.Signed-off-by: Eduardo Valentin
Signed-off-by: Zhang Rui
25 Apr, 2013
2 commits
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Remove defines that are not in used.
Signed-off-by: Eduardo Valentin
Acked-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui -
Update header list for cpu_cooling.h. Missing definition of cpumask.
Signed-off-by: Eduardo Valentin
Acked-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui
14 Apr, 2013
1 commit
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Signed-off-by: Zhang Rui
Acked-by: Eduardo Valentin
Acked-by: Durgadoss R
26 Mar, 2013
1 commit
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Signed-off-by: Zhang Rui
Tested-by: Amit Daniel kachhap
22 Nov, 2012
2 commits
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As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) ywith the following drive:
CONFIG_OMAP_BANDGAP=mgenerates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!This patch changes cpu cooling driver to allow it
to be built as module.Reported-by: Enric Balletbo i Serra
Signed-off-by: Eduardo Valentin
Reviewed-by: Durgadoss R
Signed-off-by: Zhang Rui -
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.include/linux/cpumask.h
* The following particular system cpumasks and operations manage
* possible, present, active and online cpus.
*
* cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
* cpu_present_mask - has bit 'cpu' set iff cpu is populated
* cpu_online_mask - has bit 'cpu' set iff cpu available to scheduler
* cpu_active_mask - has bit 'cpu' set iff cpu available to migration
*Signed-off-by: Eduardo Valentin
Signed-off-by: Zhang Rui
24 Sep, 2012
1 commit
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This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.A simple data/control flow diagrams is shown below,
Core Linux thermal Exynos thermal interface
Cc: Guenter Roeck
Cc: SangWook Ju
Cc: Durgadoss
Cc: Len Brown
Cc: Jean Delvare
Cc: Kyungmin Park
Cc: Kukjin Kim
Signed-off-by: Andrew Morton
Signed-off-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui
