Eric Lee / smarc-ti-linux-kernel

03 Sep, 2013

2 commits

  • a8892d838   thermal: thermal_core: allow binding with limits on bind_params ... Browse Code »

    When registering a thermal zone device using platform information
    via bind_params, the thermal framework will always perform the
    cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

    This patch changes the data structures so that it is possible
    to inform what are the desired limits for each trip point
    inside a bind_param. The way the binding is performed is also
    changed so that it uses the new data structure.

    Cc: Zhang Rui
    Cc: linux-pm@vger.kernel.org
    Cc: linux-kernel@vger.kernel.org
    Signed-off-by: Eduardo Valentin

    Eduardo Valentin
     
  • ccba4ffd9   drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional ... Browse Code »

    When registering a new thermal_device, the thermal framework
    will always add a hwmon sysfs interface.

    This patch adds a flag to make this behavior optional. Now
    when registering a new thermal device, the caller can
    optionally inform if hwmon interface is desirable. This can
    be done by means of passing a thermal_zone_params.no_hwmon == true.

    In order to keep same behavior as of today, all current
    calls will by default create the hwmon interface.

    Cc: David Woodhouse
    Cc: linux-acpi@vger.kernel.org
    Cc: linux-arm-kernel@lists.infradead.org
    Cc: linux-kernel@vger.kernel.org
    Cc: linux-pm@vger.kernel.org
    Cc: Zhang Rui
    Suggested-by: Wei Ni
    Signed-off-by: Eduardo Valentin

    Eduardo Valentin
     

13 Aug, 2013

1 commit

12 Jul, 2013

1 commit

  • 8cbd0eefc   Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux ... Browse Code »

    Pull thermal management updates from Zhang Rui:
    "There are not too many changes this time, except two new platform
    thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
    driver, and a couple of small fixes.

    Highlights:

    - move the ti-soc-thermal driver out of the staging tree to the
    thermal tree.

    - introduce the x86_pkg_temp_thermal driver. This driver registers
    CPU digital temperature package level sensor as a thermal zone.

    - small fixes/cleanups including removing redundant use of
    platform_set_drvdata() and of_match_ptr for all platform thermal
    drivers"

    * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
    thermal: cpu_cooling: fix stub function
    thermal: ti-soc-thermal: use standard GPIO DT bindings
    thermal: MAINTAINERS: Add git tree path for SoC specific updates
    thermal: fix x86_pkg_temp_thermal.c build and Kconfig
    Thermal: Documentation for x86 package temperature thermal driver
    Thermal: CPU Package temperature thermal
    thermal: consider emul_temperature while computing trend
    thermal: ti-soc-thermal: add DT example for DRA752 chip
    thermal: ti-soc-thermal: add dra752 chip to device table
    thermal: ti-soc-thermal: add thermal data for DRA752 chips
    thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
    thermal: ti-soc-thermal: freeze FSM while computing trend
    thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
    thermal: ti-soc-thermal: update DT reference for OMAP5430
    x86, mcheck, therm_throt: Process package thresholds
    thermal: cpu_cooling: fix 'descend' check in get_property()
    Thermal: spear: Remove redundant use of of_match_ptr
    Thermal: kirkwood: Remove redundant use of of_match_ptr
    Thermal: dove: Remove redundant use of of_match_ptr
    Thermal: armada: Remove redundant use of of_match_ptr
    ...

    Linus Torvalds
     

18 Jun, 2013

1 commit

28 May, 2013

1 commit

27 Apr, 2013

1 commit

25 Apr, 2013

1 commit

14 Apr, 2013

1 commit

  • 80a26a5c2   Thermal: build thermal governors into thermal_sys module ... Browse Code »
    16

    The thermal governors are part of the thermal framework,
    rather than a seperate feature/module.
    Because the generic thermal layer can not work without
    thermal governors, and it must load the thermal governors
    during its initialization.

    Build them into one module in this patch.

    This also fix a problem that the generic thermal layer does not
    work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

    Signed-off-by: Zhang Rui
    Acked-by: Eduardo Valentin
    Acked-by: Durgadoss R

    Zhang Rui
     

02 Apr, 2013

2 commits

  • 8837295a7   thermal: add a warning for temperature emulation feature ... Browse Code »

    Because this feature is for debuging purposes, it is highly
    recommended to do not enable this on production systems.
    This patch adds warnings for system integrators, so that
    people are aware of this potential security issue.

    Signed-off-by: Eduardo Valentin
    Signed-off-by: Zhang Rui

    Eduardo Valentin
     
  • bffd1f8ac   thermal: exynos: Adapt to temperature emulation core thermal framework ... Browse Code »

    This removes the driver specific sysfs support of the temperature
    emulation and uses the newly added core thermal framework for thermal
    emulation. An exynos platform specific handler is added to support this.

    In this patch, the exynos senor(tmu) related code and exynos framework
    related (thermal zone, cooling devices) code are intentionally kept separate.
    So an emulated function pointer is passed from sensor to framework. This is
    beneficial in adding more sensor support using the same framework code
    which is an ongoing work. The goal is to finally split them totally. Even
    the existing read_temperature also follows the same execution method.

    Acked-by: Kukjin Kim
    Signed-off-by: Amit Daniel Kachhap
    Signed-off-by: Zhang Rui

    Amit Daniel Kachhap
     

01 Mar, 2013

1 commit

  • 2af78448f   Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux ... Browse Code »

    Pull thermal management updates from Zhang Rui:
    "Highlights:

    - introduction of Dove thermal sensor driver.

    - introduction of Kirkwood thermal sensor driver.

    - introduction of intel_powerclamp thermal cooling device driver.

    - add interrupt and DT support for rcar thermal driver.

    - add thermal emulation support which allows platform thermal driver
    to do software/hardware emulation for thermal issues."

    * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
    thermal: rcar: remove __devinitconst
    thermal: return an error on failure to register thermal class
    Thermal: rename thermal governor Kconfig option to avoid generic naming
    thermal: exynos: Use the new thermal trend type for quick cooling action.
    Thermal: exynos: Add support for temperature falling interrupt.
    Thermal: Dove: Add Themal sensor support for Dove.
    thermal: Add support for the thermal sensor on Kirkwood SoCs
    thermal: rcar: add Device Tree support
    thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
    thermal: rcar: add interrupt support
    thermal: rcar: add read/write functions for common/priv data
    thermal: rcar: multi channel support
    thermal: rcar: use mutex lock instead of spin lock
    thermal: rcar: enable CPCTL to use hardware TSC deciding
    thermal: rcar: use parenthesis on macro
    Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
    Thermal: fix a wrong comment
    thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
    PM: intel_powerclamp: off by one in start_power_clamp()
    thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
    ...

    Linus Torvalds
     

20 Feb, 2013

2 commits

06 Feb, 2013

2 commits

  • e6e238c38   thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation ... Browse Code »

    This patch adds support to set the emulated temperature method in
    thermal zone (sensor). After setting this feature thermal zone may
    report this temperature and not the actual temperature. The emulation
    implementation may be based on sensor capability through platform
    specific handler or pure software emulation if no platform handler defined.

    This is useful in debugging different temperature threshold and its
    associated cooling action. Critical threshold's cannot be emulated.
    Writing 0 on this node should disable emulation.

    Signed-off-by: Amit Daniel Kachhap
    Acked-by: Kukjin Kim
    Signed-off-by: Zhang Rui

    Amit Daniel Kachhap
     
  • d6d71ee4a   PM: Introduce Intel PowerClamp Driver ... Browse Code »
    16

    Intel PowerClamp driver performs synchronized idle injection across
    all online CPUs. The goal is to maintain a given package level C-state
    ratio.

    Compared to other throttling methods already exist in the kernel,
    such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
    more efficient in terms of performance per watt.

    Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

    Signed-off-by: Arjan van de Ven
    Signed-off-by: Jacob Pan
    Signed-off-by: Zhang Rui

    Jacob Pan
     

16 Jan, 2013

1 commit

04 Jan, 2013

1 commit

  • bbf63be4f   Thermal: exynos: Add sysfs node supporting exynos's emulation mode. ... Browse Code »

    This patch supports exynos's emulation mode with newly created sysfs node.
    Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
    management unit. Thermal emulation mode supports software debug for TMU's
    operation. User can set temperature manually with software code and TMU
    will read current temperature from user value not from sensor's value.
    This patch includes also documentary placed under Documentation/thermal/.

    Signed-off-by: Jonghwa Lee
    Signed-off-by: Zhang Rui

    Jonghwa Lee
     

05 Nov, 2012

1 commit

24 Sep, 2012

3 commits

  • c48cbba6f   hwmon: exynos4: move thermal sensor driver to driver/thermal directory ... Browse Code »

    This movement is needed because the hwmon entries and corresponding sysfs
    interface is a duplicate of utilities already provided by
    driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
    and add necessary functions to use the in-kernel thermal interfaces.

    Signed-off-by: Amit Daniel Kachhap
    Acked-by: Guenter Roeck
    Cc: SangWook Ju
    Cc: Durgadoss
    Cc: Len Brown
    Cc: Jean Delvare
    Cc: Kyungmin Park
    Cc: Kukjin Kim
    Signed-off-by: Andrew Morton
    Signed-off-by: Amit Daniel Kachhap
    Signed-off-by: Zhang Rui

    Amit Daniel Kachhap
     
  • 023614183   thermal: add generic cpufreq cooling implementation ... Browse Code »

    This patchset introduces a new generic cooling device based on cpufreq
    that can be used on non-ACPI platforms. As a proof of concept, we have
    drivers for the following platforms using this mechanism now:

    * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
    * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

    There is a small change in cpufreq cooling registration APIs, so a minor
    change is needed for Freescale platforms.

    Brief Description:

    1) The generic cooling devices code is placed inside driver/thermal/*
    as placing inside acpi folder will need un-necessary enabling of acpi
    code. This code is architecture independent.

    2) This patchset adds generic cpu cooling low level implementation
    through frequency clipping. In future, other cpu related cooling
    devices may be added here. An ACPI version of this already exists
    (drivers/acpi/processor_thermal.c) .But this will be useful for
    platforms like ARM using the generic thermal interface along with the
    generic cpu cooling devices. The cooling device registration API's
    return cooling device pointers which can be easily binded with the
    thermal zone trip points. The important APIs exposed are,

    a) struct thermal_cooling_device *cpufreq_cooling_register(
    struct cpumask *clip_cpus)
    b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

    3) Samsung exynos platform thermal implementation is done using the
    generic cpu cooling APIs and the new trip type. The temperature sensor
    driver present in the hwmon folder(registered as hwmon driver) is moved
    to thermal folder and registered as a thermal driver.

    A simple data/control flow diagrams is shown below,

    Core Linux thermal Exynos thermal interface
    Cc: Guenter Roeck
    Cc: SangWook Ju
    Cc: Durgadoss
    Cc: Len Brown
    Cc: Jean Delvare
    Cc: Kyungmin Park
    Cc: Kukjin Kim
    Signed-off-by: Andrew Morton
    Signed-off-by: Amit Daniel Kachhap
    Signed-off-by: Zhang Rui

    Amit Daniel Kachhap
     
  • 9d99842f9   Thermal: set upper and lower limits ... Browse Code »

    set upper and lower limits when binding
    a thermal cooling device to a thermal zone device.

    Signed-off-by: Zhang Rui
    Reviewed-by: Rafael J. Wysocki
    Reviewed-by: Eduardo Valentin

    Zhang Rui
     

25 Jul, 2012

3 commits

  • 8eaa8d6ca   Thermal: Documentation update ... Browse Code »

    With commit 6503e5df08008b9a47022b5e9ebba658c8fa69af,
    the value of /sys/class/thermal/thermal_zoneX/mode has been changed
    from user/kernel to enabled/disabled.
    Update the documentation so that users won't be confused.

    Signed-off-by: Zhang Rui
    Signed-off-by: Len Brown

    Zhang Rui
     
  • 27365a6c7   Thermal: Add Hysteresis attributes ... Browse Code »

    The Linux Thermal Framework does not support hysteresis
    attributes. Most thermal sensors, today, have a
    hysteresis value associated with trip points.

    This patch adds hysteresis attributes on a per-trip-point
    basis, to the Thermal Framework. These attributes are
    optionally writable.

    Signed-off-by: Durgadoss R
    Signed-off-by: Zhang Rui
    Signed-off-by: Len Brown

    Durgadoss R
     
  • c56f5c034   Thermal: Make Thermal trip points writeable ... Browse Code »

    Some of the thermal drivers using the Generic Thermal Framework
    require (all/some) trip points to be writeable. This patch makes
    the trip point temperatures writeable on a per-trip point basis,
    and modifies the required function call in thermal.c. This patch
    also updates the Documentation to reflect the new change.

    Signed-off-by: Durgadoss R
    Signed-off-by: Zhang Rui
    Signed-off-by: Len Brown

    Durgadoss R
     

23 Jan, 2012

1 commit

  • 2d58d7ea9   thermal: Rename generate_netlink_event ... Browse Code »

    It doesn't seem right for the thermal subsystem to export a symbol
    named generate_netlink_event. This function is thermal-specific and
    its name should reflect that fact. Rename it to
    thermal_generate_netlink_event.

    Signed-off-by: Jean Delvare
    Acked-by: Rafael J. Wysocki
    Acked-by: R.Durgadoss
    Signed-off-by: Len Brown

    Jean Delvare
     

12 Jan, 2011

1 commit

06 Nov, 2009

3 commits

29 Apr, 2008

1 commit

13 Mar, 2008

1 commit

08 Feb, 2008

1 commit

02 Feb, 2008

1 commit