08 Jul, 2015
7 commits
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It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.Signed-off-by: Eduardo Valentin
(cherry picked from commit 9d0be7f4810257a9b0fc78fff641f14409f14ab3)
Signed-off-by: Kevin Hilman -
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace. Export them to the thermal_zone sysfs so that they can be
easily changed.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
(cherry picked from commit 9f38271c6f82a577d9fdab27aaf2e1c55ae5cf73)
Signed-off-by: Kevin Hilman -
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Punit Agrawal
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
(cherry picked from commit 6b775e870c56c59c3e16531ea2307b797395f9f7)
Signed-off-by: Kevin Hilman -
Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Kapileshwar Singh
Signed-off-by: Punit Agrawal
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
(cherry picked from commit c36cf07176316fbe6a4bdbc23afcb0cbf7822bf2)
Signed-off-by: Kevin Hilman -
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.Cc: Zhang Rui
Cc: Eduardo Valentin
Cc: Durgadoss R
Acked-by: Durgadoss R
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
(cherry picked from commit bcdcbbc71125c37195f97314f453ca9a3a4eb758)
Signed-off-by: Kevin Hilman -
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
(cherry picked from commit db91651311c8b89978b17d27634582c28c33363e)
Signed-off-by: Kevin Hilman -
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.Cc: Zhang Rui
Cc: "Rafael J. Wysocki"
Cc: Len Brown
Cc: Peter Feuerer
Cc: Darren Hart
Cc: Eduardo Valentin
Cc: Kukjin Kim
Cc: Durgadoss R
Signed-off-by: Kapileshwar Singh
Signed-off-by: Eduardo Valentin
(cherry picked from commit 6cd9e9f629f11b9412d4e9aa294c029dbb36b3cf)
Signed-off-by: Kevin Hilman
07 Jan, 2015
1 commit
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Commit 39d99cff76bf ("thermal: cpu_cooling: introduce
of_cpufreq_cooling_register") taught the cpu cooling device to register
devices that were linked to the device tree but didn't update the
cpu-cooling-api documentation. Fix it.Cc: Amit Daniel Kachhap
Cc: Jonathan Corbet
Cc: Zhang Rui
Cc: Eduardo Valentin
Signed-off-by: Javi Merino
Signed-off-by: Eduardo Valentin
17 Jun, 2014
1 commit
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Changes:
- Change the maintainer's address (the labri address will expire soon);
- Drop the note about not all families supporting all fan modes;
- Add a note about the reported RPM not being accurate when driven outside
the vbios-defined PWM range.Signed-off-by: Martin Peres
Signed-off-by: Ben Skeggs
03 Sep, 2013
2 commits
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When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.Cc: Zhang Rui
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin -
When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.Cc: David Woodhouse
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui
Suggested-by: Wei Ni
Signed-off-by: Eduardo Valentin
13 Aug, 2013
1 commit
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This patch updates the documentation to explain the driver model
and file layout.Acked-by: Jonghwa Lee
Acked-by: Kukjin Kim
Acked-by: Eduardo Valentin
Signed-off-by: Amit Daniel Kachhap
Signed-off-by: Eduardo Valentin
12 Jul, 2013
1 commit
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Pull thermal management updates from Zhang Rui:
"There are not too many changes this time, except two new platform
thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
driver, and a couple of small fixes.Highlights:
- move the ti-soc-thermal driver out of the staging tree to the
thermal tree.- introduce the x86_pkg_temp_thermal driver. This driver registers
CPU digital temperature package level sensor as a thermal zone.- small fixes/cleanups including removing redundant use of
platform_set_drvdata() and of_match_ptr for all platform thermal
drivers"* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
thermal: cpu_cooling: fix stub function
thermal: ti-soc-thermal: use standard GPIO DT bindings
thermal: MAINTAINERS: Add git tree path for SoC specific updates
thermal: fix x86_pkg_temp_thermal.c build and Kconfig
Thermal: Documentation for x86 package temperature thermal driver
Thermal: CPU Package temperature thermal
thermal: consider emul_temperature while computing trend
thermal: ti-soc-thermal: add DT example for DRA752 chip
thermal: ti-soc-thermal: add dra752 chip to device table
thermal: ti-soc-thermal: add thermal data for DRA752 chips
thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
thermal: ti-soc-thermal: freeze FSM while computing trend
thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
thermal: ti-soc-thermal: update DT reference for OMAP5430
x86, mcheck, therm_throt: Process package thresholds
thermal: cpu_cooling: fix 'descend' check in get_property()
Thermal: spear: Remove redundant use of of_match_ptr
Thermal: kirkwood: Remove redundant use of of_match_ptr
Thermal: dove: Remove redundant use of of_match_ptr
Thermal: armada: Remove redundant use of of_match_ptr
...
18 Jun, 2013
1 commit
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Added documentation describing details of the x86 package temperature
thermal driver.Signed-off-by: Srinivas Pandruvada
Signed-off-by: Zhang Rui
28 May, 2013
1 commit
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Signed-off-by: Anatol Pomozov
Signed-off-by: Jiri Kosina
27 Apr, 2013
1 commit
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Update kernel Documentation for thermal_zone_device_register.
Signed-off-by: Zhang Rui
25 Apr, 2013
1 commit
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To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.Signed-off-by: Eduardo Valentin
Signed-off-by: Zhang Rui
14 Apr, 2013
1 commit
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The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.Build them into one module in this patch.
This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.Signed-off-by: Zhang Rui
Acked-by: Eduardo Valentin
Acked-by: Durgadoss R
02 Apr, 2013
2 commits
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Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.Signed-off-by: Eduardo Valentin
Signed-off-by: Zhang Rui -
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.Acked-by: Kukjin Kim
Signed-off-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui
01 Mar, 2013
1 commit
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Pull thermal management updates from Zhang Rui:
"Highlights:- introduction of Dove thermal sensor driver.
- introduction of Kirkwood thermal sensor driver.
- introduction of intel_powerclamp thermal cooling device driver.
- add interrupt and DT support for rcar thermal driver.
- add thermal emulation support which allows platform thermal driver
to do software/hardware emulation for thermal issues."* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
thermal: rcar: remove __devinitconst
thermal: return an error on failure to register thermal class
Thermal: rename thermal governor Kconfig option to avoid generic naming
thermal: exynos: Use the new thermal trend type for quick cooling action.
Thermal: exynos: Add support for temperature falling interrupt.
Thermal: Dove: Add Themal sensor support for Dove.
thermal: Add support for the thermal sensor on Kirkwood SoCs
thermal: rcar: add Device Tree support
thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
thermal: rcar: add interrupt support
thermal: rcar: add read/write functions for common/priv data
thermal: rcar: multi channel support
thermal: rcar: use mutex lock instead of spin lock
thermal: rcar: enable CPCTL to use hardware TSC deciding
thermal: rcar: use parenthesis on macro
Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
Thermal: fix a wrong comment
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
PM: intel_powerclamp: off by one in start_power_clamp()
thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
...
20 Feb, 2013
2 commits
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Fan speed info now shown by sensors.
Signed-off-by: Ben Skeggs
-
Signed-off-by: Martin Peres
Signed-off-by: Ben Skeggs
06 Feb, 2013
2 commits
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This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.Signed-off-by: Amit Daniel Kachhap
Acked-by: Kukjin Kim
Signed-off-by: Zhang Rui -
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.Please refer to Documentation/thermal/intel_powerclamp.txt for more details.
Signed-off-by: Arjan van de Ven
Signed-off-by: Jacob Pan
Signed-off-by: Zhang Rui
16 Jan, 2013
1 commit
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This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.This way, the messages will always be bound to a thermal zone.
Signed-off-by: Eduardo Valentin
Reviewed-by: Durgadoss R
Signed-off-by: Zhang Rui
04 Jan, 2013
1 commit
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This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.Signed-off-by: Jonghwa Lee
Signed-off-by: Zhang Rui
05 Nov, 2012
1 commit
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This patch adds documentation for thermal_bind_params
and thermal_zone_params structures. Also, adds details
on EXPORT_SYMBOL APIs.Signed-off-by: Durgadoss R
Signed-off-by: Zhang Rui
24 Sep, 2012
3 commits
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This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.Signed-off-by: Amit Daniel Kachhap
Acked-by: Guenter Roeck
Cc: SangWook Ju
Cc: Durgadoss
Cc: Len Brown
Cc: Jean Delvare
Cc: Kyungmin Park
Cc: Kukjin Kim
Signed-off-by: Andrew Morton
Signed-off-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui -
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.A simple data/control flow diagrams is shown below,
Core Linux thermal Exynos thermal interface
Cc: Guenter Roeck
Cc: SangWook Ju
Cc: Durgadoss
Cc: Len Brown
Cc: Jean Delvare
Cc: Kyungmin Park
Cc: Kukjin Kim
Signed-off-by: Andrew Morton
Signed-off-by: Amit Daniel Kachhap
Signed-off-by: Zhang Rui -
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.Signed-off-by: Zhang Rui
Reviewed-by: Rafael J. Wysocki
Reviewed-by: Eduardo Valentin
25 Jul, 2012
3 commits
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With commit 6503e5df08008b9a47022b5e9ebba658c8fa69af,
the value of /sys/class/thermal/thermal_zoneX/mode has been changed
from user/kernel to enabled/disabled.
Update the documentation so that users won't be confused.Signed-off-by: Zhang Rui
Signed-off-by: Len Brown -
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.Signed-off-by: Durgadoss R
Signed-off-by: Zhang Rui
Signed-off-by: Len Brown -
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.Signed-off-by: Durgadoss R
Signed-off-by: Zhang Rui
Signed-off-by: Len Brown
23 Jan, 2012
1 commit
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It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.Signed-off-by: Jean Delvare
Acked-by: Rafael J. Wysocki
Acked-by: R.Durgadoss
Signed-off-by: Len Brown
12 Jan, 2011
1 commit
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This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.Signed-off-by: R.Durgadoss
Signed-off-by: Len Brown
06 Nov, 2009
3 commits
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Values below 1000 milli-celsius don't make sense and can cause the
system to go into a thermal heart attack: the actual temperature
will always be lower and thus the system will be throttled down to
its lowest setting.An additional problem is that values below 1000 will show as 0 in
/proc/acpi/thermal/TZx/trip_points:passive.cat passive
0
echo -n 90 >passive
bash: echo: write error: Invalid argument
echo -n 90000 >passive
cat passive
90000Signed-off-by: Frans Pop
Acked-by: Zhang Rui
Signed-off-by: Andrew Morton
Signed-off-by: Len Brown -
Signed-off-by: Frans Pop
Acked-by: Zhang Rui
Signed-off-by: Andrew Morton
Signed-off-by: Len Brown -
The document currently uses large indentations which make the text
too wide for easy readability. Also improve general consistency.Signed-off-by: Frans Pop
Acked-by: Zhang Rui
Signed-off-by: Andrew Morton
Signed-off-by: Len Brown
29 Apr, 2008
1 commit
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Update the documentation for the thermal driver hwmon sys I/F.
Change the ACPI thermal zone type to be consistent with hwmon.
Signed-off-by: Zhang Rui
Acked-by: Jean Delvare
Signed-off-by: Len Brown