15 Jan, 2017

1 commit


14 Apr, 2016

1 commit


12 Apr, 2016

1 commit


11 Apr, 2016

2 commits


30 Mar, 2016

1 commit


04 Mar, 2016

11 commits


06 Nov, 2015

1 commit


04 Nov, 2015

1 commit

  • The ci_udc driver tries to use the ULPI interface for the USB OTG controller,
    but this type is not supported by all i.MX6 and i.MX7 platforms. When setting to
    ULPI, other platforms except the 6UL refuse the settings and keep default value.
    But on 6UL, the PTW bit of PORTSC1 register which is documented as RO can change.
    This cause the interface setting problem with USB PHY.

    Fix the issue by removing the ULPI setting for i.MX6 and i.MX7. All will use default
    UTMI setting.

    Signed-off-by: Ye.Li

    Ye.Li
     

16 Oct, 2015

1 commit

  • The cod change updated the NAND driver BCH ECC layout algorithm to
    support large oob size NAND chips(oob > 1024 bytes).

    Current implementation requires each chunk size larger than oob size so
    the bad block marker (BBM) can be guaranteed located in data chunk. The
    ECC layout always using the unbalanced layout(Ecc for both meta and
    Data0 chunk), but for the NAND chips with oob larger than 1k, the driver
    cannot support because BCH doesn’t support GF 15 for 2K chunk.

    The change keeps the data chunk no larger than 1k and adjust the ECC
    strength or ECC layout to locate the BBM in data chunk. General idea for
    large oob NAND chips is

    1.Try all ECC strength from the minimum value required by NAND spec to
    the maximum one that works, any ECC makes the BBM locate in data chunk
    can be chosen.

    2.If none of them works, using separate ECC for meta, which will add one
    extra ecc with the same ECC strength as other data chunks. This extra
    ECC can guarantee BBM located in data chunk, of course, we need to check
    if oob can afford it.

    Signed-off-by: Han Xu

    Han Xu
     

28 Aug, 2015

1 commit


03 Aug, 2015

2 commits

  • Since setup_waveform_file in different boards code have same implementation,
    move setup_waveform_file to board common code. Also rename it to
    board_setup_waveform_file

    This patch also fix a bug when using flush_cache. We should pass
    'waveform_buf' to flush_cache, but not a string named 'addr'.

    Signed-off-by: Peng Fan

    Peng Fan
     
  • Support draw image on E-ink screen.
    1. The image format should be PGM-P5 raw data format.
    2. The image should be named epdc_logo.pgm.
    3. If no epdc_logo.pgm found in the first partition(FAT), will choose
    to draw black border on the screen.
    4. Default configuration is to draw image at pos (0,0). If 'splashpos'
    env is set, will choose the pos from 'splashpos'.
    5. The image size should not be bigger than screen total pixel size.
    6. Implement board_setup_logo_file in board/freescale/common/epdc_setup.c
    7. Introudce function prototype for board_setup_logo_file.

    Note: i.MX7D EPDC supports advanced mode and standard mode. Since current
    PXP in uboot for i.MX7D not ready, only support standard mode now.
    advanced and standard mode needs waveform firmware's support.

    Signed-off-by: Peng Fan

    Peng Fan
     

28 Jul, 2015

1 commit

  • The bootargs is not set correctly.
    The final bootargs consist of uboot's bootargs and bootimg's bootargs.
    This patch set bootimg's bootargs as final bootargs if uboot's bootargs is not set.
    And take uboot's bootargs as final bootargs if uboot's bootargs is set.

    Signed-off-by: zhang sanshan

    zhang sanshan
     

27 Jul, 2015

1 commit


13 Jul, 2015

3 commits

  • Enable fastboot command "fastboot flash data"
    Custom may need to update data partition in fastboot mode.
    This patch enable flash data partition in emmc\sd.

    Signed-off-by: Zhang Sanshan
    Signed-off-by: Ye.Li

    Ye.Li
     
  • enable fastboot command: "fastboot reboot-bootloader"
    After type this command, the board will reboot to bootloader mode.
    Set ANDROID_FASTBOOT_BOOT flag in SNVS_LPGPR before reboot.

    Signed-off-by: Zhang Sanshan
    Signed-off-by: Ye.Li

    Ye.Li
     
  • 1. Replace the UDC driver with community's USB gadget d_dnl driver.
    2. Integrate the FSL SD/SATA/NAND flash operations, since the GPT and
    EFI partitions are not support by i.MX.
    3. Add FDT support to community's android image.
    4. Change the booti command to boota, due to the booti has been used for
    ARM64 image boot.
    5. Modify boota implementation to load ramdisk and fdt to their loading
    addresses specified in boot.img header, while bootm won't do it for
    android image.
    6. Modify the android image HAB implementation. Authenticate the boot.img
    on the "load_addr" for both SD and NAND.
    7. Enable new configuration CONFIG_FSL_FASTBOOT for Freescale's fastboot
    with relevant header file "fsl_fastboot.h". While disabling the
    configuration, the community fastboot is used.
    8. Use community's way to combine cmdline in boot.img and u-boot environment,
    not overwrite the cmdline in boot.img

    Signed-off-by: Ye.Li

    Ye.Li
     

12 Jun, 2015

1 commit

  • From temp sensor guys:
    "
    I confirmed the math with him(had do the accuracy study) today.
    The new, final equation is:

    Tmeas = (Nmeas - n1) / slope + t1 + offset

    n1= fused room count
    t1= 25
    offset=3.580661
    slope= 0.4148468 – 0.0015423*n1
    "

    87723f903454aaf17336e0fe9098ea7911c19f3c update the thermal with not
    accurate slope parameters. This patch fix it.

    Signed-off-by: Peng Fan

    Peng Fan
     

29 May, 2015

1 commit

  • There is a hole in shadow registers address map of size 0x100
    between bank 5 and bank 6 on iMX6QP, iMX6DQ, iMX6SDL, iMX6SX and iMX6UL.
    Bank 5 ends at 0x6F0 and Bank 6 starts at 0x800. When reading the fuses,
    we should account for this hole in address space.

    Similar hole exists between bank 14 and bank 15 of size
    0x80 on iMX6QP, iMX6DQ, iMX6SDL and iMX6SX.
    Note: iMX6SL has only 0-7 banks and there is no hole.
    Note: iMX6UL doesn't have this one.

    When reading, we use register offset, so need to account for holes
    to get the correct address.
    When writing, we use bank/word index, there is no need to account
    for holes, always use bank/word index from fuse map.

    Signed-off-by: Nitin Garg
    Signed-off-by: Peng Fan

    Peng Fan
     

20 May, 2015

1 commit


13 May, 2015

1 commit


07 May, 2015

3 commits


06 May, 2015

1 commit

  • From IC guys:
    "
    After a thorough accuracy study of the Temp sense circuit,
    we found that with our current equation, an average part can
    read 7 degrees lower than a known forced temperature.
    We also found out that the standard variance was around 2C;
    which is the tightest distribution that we could create.
    We need to change the temp sense equation to center the average
    part around the target temperature.

    Old Equation:
    Temp = Troom,cal – slope*(Count measured – Count room fuse)
    Where
    Troom,cal = 25C and
    Slope = 0.4297157 – (0.0015974 * Count room fuse)

    New Equation:
    Temp = Troom,cal – slope*(Count measured – Count room fuse) +offset
    Where
    Troom,cal = 25C and
    Slope = 0.4445388 – (0.0016549 * Count room fuse)
    Offset = 3.580661
    "

    According the new equation, update the thermal driver.
    c1 and c2 changed to u64 type and update comments.

    Signed-off-by: Peng Fan

    Peng Fan
     

05 May, 2015

4 commits